Luminate for the formation of beam leads for IC chip bonding
AssigneeEastman Kodak Company
InventorsGerald W. Klein, Robert C. McConkey, Michel F. Molaire, John M. Noonan
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AssigneeEastman Kodak Company
InventorsGerald W. Klein, Robert C. McConkey, Michel F. Molaire, John M. Noonan
Estimating the term…
A laminate, adapted for manufacturing frames of metal beam leads that are bonded to integrated circuit chips, comprises (a) a flexible metal strip, (b) a layer of a first resist adhered to one surface of the metal strip, and (c) a layer of a second resist adhered to the opposite surface of the metal strip, the second resist being a negative-working resist comprising (1) a polymeric binder, (2) a photopolymerizable monomer mixture, and (3) a photoinitiator composition. The negative-working resist exhibits excellent flexibility and adhesion to the metal and superior performance during high temperature processing, whereby it serves effectively as a support for the beam leads.
A laminate, adapted for manufacturing frames of metal beam leads that are bonded to integrated circuit chips, said laminate comprising
Dependencies are inferred from the claim text.