Self-aligning liquid-cooling assembly
AssigneeUnisys Corporation
InventorsEdward A. Nicol, George J. Adrian
Life of this patent
Estimating the term…
Abstract
An assembly for cooling an array of IC packages which have respective non-coplanar heat dissipating surfaces, comprises: a frame that is attachable to the array and has multiple beams, each of which is positioned to overlie some of the IC packages; respective liquid-cooling jackets for the IC packages with each jacket having a heat absorbing face; each jacket being mounted via a post that is loosely fitted through a respective hole in one of the beams in proximity with a respective one of the IC packages; and each jacket mounting providing a flexible connection which allows the jacket's heat absorbing face to be placed at multiple angles and different heights, and thereby coincide with the non-coplanar heat dissipating surface of an IC package.
Claims11
A liquid cooled assembly of IC packages on a printed circuit board, wherein said packages have respective heat dissipating surfaces which are at different heights and different angles relative to each other, and wherein the cooling portion of said assembly comprises:
- an input manifold and an output manifold, for carrying a liquid, which are spaced apart on said board, such that said IC packages lie there between;
- multiple beams, each of which is attached to said manifolds and overlies several IC packages;
- each beam having holes which are proximately aligned with those packages which it overlies;
- respective liquid cooling jackets for said IC packages, with each jacket having a heat absorbing face;
- hoses which carry liquid from said input manifold through said jackets to said output manifold;
- each jacket including a guide post, which passes through a respective one of said holes in said beams, and a retainer that keeps the post in the hole;
- each post being loosely fitted in its hole such that the heat absorbing face of the corresponding cooling jacket can move up and down and tilt to coincide with said heat dissipating surface of an IC package;
- and
- respective springs, which are compressed between each of said cooling jackets and the beams to which those jackets are attached, that force each heat absorbing face against a respective heat dissipating surface.
An assembly, for cooling IC packages which are mounted on a printed circuit board and have respective heat dissipating surfaces which are at different heights and different angles relative to each other, comprising:
- first and second supports which are spaced apart and are attachable to said printed circuit board;
- multiple beams, each of which is attached to said supports and is positioned to overlie some of said IC packages;
- each beam having holes which are proximately aligned with those IC packages that it is to overlie;
- respective liquid cooling jackets for each of said IC packages with each jacket having a heat absorbing face;
- each jacket including a guide post which passes through a respective hole in one of said beams and a retainer that keeps the post in the hole;
- and
- each post being loosely fitted in its hole such that the heat absorbing face of the corresponding cooling jacket can move up and down and tilt to coincide with said heat dissipating surface of an IC package.
An assembly for cooling an array of IC packages which have respective non-planar heat dissipating surfaces, comprising:
- a frame that is attachable to said array and includes multiple beams, each of which is positioned to overlie some of said IC packages;
- respective liquid cooling jackets for said IC packages with each jacket having a heat absorbing face;
- each jacket including a guide post which passes through a respective hole in one of said beams and a retainer that keeps the post in the hole;
- and
- each post being loosely fitted in its hole such that the heat absorbing face of the corresponding cooling jacket can move up and down and tilt to coincide with said heat dissipating surface of an IC package.
Dependencies are inferred from the claim text.