Plastic package for high frequency semiconductor devices

Abstract

A plastic semiconductor package suitable for high frequency operation includes an internal ground plane connected to a ground ring formed on the packaged semiconductor device. The ground plane is included as a portion of a lead frame strip adjacent to the individual lead frames. The ground plane is first folded underneath the paddle support of the lead frame, and the semiconductor die subsequently mounted on the paddle. The ground plane includes a plurality of bumps which protect upward between adjacent lead fingers of the lead frame when the ground frame is folded. A ground frame on the semiconductor die is connected to the bumps, and the signal bonding pads connected to the lead fingers, typically by wire or tape bonding. The package is then encapsulated in plastic by conventional means, and the package trimmed to its final desired configuration.

Dependencies are inferred from the claim text.