Radiation-sensitive semiconductor device
AssigneeU.S. Philips Corporation
InventorArthur M. E. Hoeberechts
Life of this patent
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Abstract
In a radiation-sensitive semiconductor device, for example a quadrant diode, having several rectifying junctions, the mutual distance between these junctions can be considerably reduced by keeping the junctions cut off by means of circuit elements in such manner that associated depletion regions touch each other. Charge carriers generated between two junctions are substantially always collected by the appropriate junction. With this arrangement, low crosstalk and good high-frequency properties can be realized. Furthermore, the semiconductor body in which the rectifying junctions are realized may comprise further circuit elements, which permits integration of the radiation-sensitive semiconductor device with other elements.
Claims12
A radiation sensitive semiconductor device comprising a semiconductor body having a substrate, an epitaxial semiconductor layer on said substrate and having a substantially flat surface exposed to radiation during operation, the resistivity of said semiconductor layer being between about 50-200 ohm.cm and the resistivity of said substrate being substantially less than 50 ohm.cm, at least one radiation-sensitive element at said surface, said radiation-sensitive element comprising at least two radiation-sensitive sub-elements forming rectifying junctions with said semiconductor layer, means for separately applying a reverse bias to said rectifying junctions of each of said sub-elements, the distance between adjacent sub-elements and the thickness of said semiconductor layer being so small that in operation the depletion regions associated with said rectifying junctions extend in a lateral direction parallel to said surface so as to merge, and extend in a vertical direction perpendicular to said surface so as to deplete said semiconductor layer over the greater part of its thickness, the lateral distance between adjacent sub-elements being at most equal to twice the thickness in the lateral direction of the depletion region located laterally adjacent and associated with each sub-element during operation, each of said radiation-sensitive sub-elements comprising means for detecting a current through said sub-element generated by radiation impinging on said surface, and the surface area between adjacent radiation-sensitive sub-elements and the major part of each of said sub-elements being accessible to said radiation.
Dependencies are inferred from the claim text.