Multilayer printed wiring board and method for producing the same
AssigneeFurukawa Denki Kogyo Kabushiki Kaisha
InventorsIsao Shirahata, Shoji Shiga, Hisako Hori, Takamasa Jinbo
Life of this patent
Estimating the term…
Abstract
A multilayer printed wiring board produced by the buildup process. A first layer printed wiring pattern (13) is formed on a metal core (11) through a first insulation laminate (12), and a second layer printed wiring pattern (16) is formed on the first layer printed wiring pattern through through studs (15) and a second insulation laminate (14). The surface of the first layer printed wiring pattern (13) is roughened and the through studs (15) are formed by the buildup process using a conductive paste on the roughened surface.
Claims19
A multilayer printed wiring board comprising:
- a metal core;
- a first insulating laminate disposed on said metal core;
- a first layer of printed wiring pattern laminated to said first insulating laminate, said first layer of printed wiring pattern comprising a metal layer whose one surface on the side away from said first insulating laminate is roughened in a manner that an average value of the differences in height between peaks and valleys thereof is 1.mu. mm or more, a second layer of printed wiring pattern made of a cured conductive paste;
- a second insulating laminate disposed to electrically insulate said first and second layers of printed wiring patterns from each other;
- and
- a plurality of through studs forming conducting paths between said first layer of printed wiring pattern and said second layer of printed wiring pattern, said through studs being made of a cured conductive paste,
- whereby said multilayer printed wiring board has excellent heat dissipating properties.
Dependencies are inferred from the claim text.