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US 4,791,238 AGranted
High-density wired circuit board using insulated wires
AssigneeHitachi Chemical Company, Ltd.
InventorsMasao Kanno, Naoki Fukutomi, Yorio Iwasaki, Fujio Kojima, Hidehiro Nakamura
Life of this patent
Estimating the term…
Abstract
A high-density wired circuit board obtained by providing an auxiliary grid at the position of centroid of a main grid and by employing wiring in the inclined direction mainly instead of wiring in the XY directions mainly can make the space between wires and through-holes large without narrowing a wiring pitch.
Claims20
A high-density wired circuit board comprising:
- an adhesive coating layer formed on an insulating substrate;
- a first wiring grid of insulated conductors formed on said insulating substrate in X-Y directions;
- a second wiring grid of insulated conductors formed on said insulating substrate in said X-Y directions, and being spaced apart from said first wiring grid;
- a third wiring grid of insulated conductors formed on said insulating substrate at an angle of 45.degree. with said first and second wiring grids;
- a plurality of through-holes being disposed in said insulating substrate at positions corresponding to centroids of said first wiring grid, such that the distance between adjacent through-holes in each of said X and Y directions is 100 mils.
2 more elements
A process for producing a high density wired circuit board using insulated wires, comprising the steps of:
- forming a adhesive coating layer of an insulating substrate;
- forming a first wiring grid of insulated conductors on said insulating substrate in X-Y directions;
- forming a second wiring grid of insulated conductors on said insulating substrate in said X-Y directions and spaced apart from said first wiring grid;
- forming a third wiring grid of insulated conductors on said insulating substrate at an angle of 45.degree. with said first and second wiring grids;
- forming a plurality of through-holes in said insulating substrate at positions corresponding to centroids of said first wiring grid, such that the distance between adjacent through-holes in each of said X and Y directions is 100 mils.
2 more elements
Dependencies are inferred from the claim text.