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US 4,791,047 AGranted
Color solid image pickup element
AssigneeFuji Photo Film Co., Ltd.
InventorsJin Murayama, Hiroshi Tamura, Yoshimitsu Kudoh
Life of this patent
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Abstract
A color solid image pickup element is made up of a semiconductor element, and a color filter bonded through a buffer layer to the semiconductor element, so that, when the semiconductor element and the color filter are joined together, the semiconductor element may not be damaged by foreign matter such as shavings.
Claims3
A color solid image pickup element, comprising:
- a semiconductor chip;
- a color filter bonded to said semiconductor chip, wherein said color filter is a film filter of a lamination structure comprising a transparent glass substrate and at least one dielectric layer vacuum-deposited on said substrate;
- a buffer layer comprising a transparent resin interposed between said color filter and said semiconductor chip;
- and an adhesive interposed between said buffer layer and said semiconductor chip, whereby said color filter is bonded to said semiconductor chip.
1 more element
Dependencies are inferred from the claim text.