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US 4,790,894 AGranted
Process for producing printed wiring board
AssigneeHitachi Condenser Co., Ltd.
InventorsMasaji Homma, Hitoshi Yamauchi
Life of this patent
Estimating the term…
Abstract
A base board having a plurality of semicircular through-holes filled with solder at side walls produced by filling through-holes with solder can be connected electrically to printed circuit boards with large connecting strength and high reliability.
Claims8
A process for producing base boards for printed wiring boards which comprises:
- forming through-holes in predetermined portions of a base sheet,
- filling solder in the through-holes, and
- cutting the base sheet to provide a plurality of adjacent base boards having semicircular through-holes filled with solder at side walls extending along adjacent base boards.
Dependencies are inferred from the claim text.