Method and system for multi-layer printed circuit board pre-drill processing
AssigneeLoma Park Associates
InventorsJohn W. Wilent, Robert F. Benson, Robert A. Sparks
Life of this patent
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AssigneeLoma Park Associates
InventorsJohn W. Wilent, Robert F. Benson, Robert A. Sparks
Estimating the term…
A method and apparatus for optimizing the drilling position of a multi-layer printed circuit board prior to drilling. A template having precisely located target holes and fixture reference marks provides initial coordinate reference information for multi-layer printed circuit boards to be inspected by x radiation. Each board is processed by insertion into a holding fixture, examination of four quadrant target areas using x-ray sources and detectors, digitization of the target area images in each quadrant, and computaton of the optimum board position in a follow-on drilling apparatus. After optimization, three reference holes are punched along one edge of the board to provide accurate fiducial positioning marks when the board is placed in the drilling apparatus.
A method of preparing a multi-layer printed circuit board for automatic drilling in a drilling apparatus, said board comprising a laminated stack of individual boards each having a plurality of target areas located at predetermined locations thereon so that corresponding target areas on different individual boards overlap, said method comprising the steps of:
A system for enabling the preparation of a multi-layer printed circuit board for automatic drilling in a drilling apparatus, said board comprising a laminated stack of individual boards each having a plurality of target areas located at predetermined locations thereof so that corresponding target areas on different individual boards overlap, said system comprising:
Dependencies are inferred from the claim text.