Packaging combination
AssigneeThe Crowell Corporation
InventorLewis R. Raszewsi
Life of this patent
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Abstract
Integrated circuit with leads extending essentially in one direction is packaged by pushing it against layer of crisp foam that can be electrically conductive, to cause the leads to penetrate into the foam. The integrated circuit is then covered with a plastic film that is adhered to the foam around the integrated circuit. Anti-stat coatings are applied on the various surfaces, and plastic film can be metallized.
Claims7
A packaging assembly for an integrated circuit having a number of connector leads projecting in essentially the same direction, the assembly having a layer of electrically conductive crisp plastic foam about 5 to about 8 millimeters thick, an anti-stat cohesive-nonadhesive coating on a first face of the foam layer, a polyethylene terephthalate film about 25 microns thick laminated to the opposite face of the foam, an anti-stat coating on said film, the integrated circuit being mounted on a central portion of said first foam face with said leads penetrating through that face into the foam, the integrated circuit being covered by a second polyethylene terephthalate film that has one of its faces coated with an anti-stat cohesive-nonadhesive layer and has that face adhered to the anti-stat cohesive-nonadhesive layer on the foam around the integrated circuit.
A packaging laminate of crisp electrically conductive plastic foam about 5 to about 8 millimeters thick laminated on one face to a film of metallized polyethylene terephthalate about 25 microns thick, the outer face of the foam being coated with an anti-stat cohesive-nonadhesive layer, and the outer face of the film being coated with an anti-stat layer.
Dependencies are inferred from the claim text.