An epoxy resin composition which demonstrates rapid curing even at ambient temperatures to provide materials useful in development of adhesive, coatings, encapsulants, laminates and composite fabrications, said composition comprising an amidoamine prepared from:
- (1) an alkyl substituted aromatic dicarboxylic acid selected from the group consisting of phenylindane dicarboxylic and t-butyl isophthalic acid;
- and
- (2) a polyetherpolyamine from the group consisting of polyoxyethyleneamine and polyoxypropyleneamine;
- and
- (3) an epoxy resin where said amidoamine is the curing agent for the epoxy resin and is present in said mixture in an amount sufficient to provide about 0.8 to 1.2 amino groups per oxirane group.