Method for manufacturing multi-layer printed circuit boards
AssigneeE. I. Du Pont de Nemours and Company
InventorPeter P. Pelligrino
Life of this patent
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Abstract
Methods and apparatus for providing fine line, high density multiple layer printed circuit board packages are disclosed. In the method for fabricating multiple layer printed circuit board package, a printed circuit board is formed having a conductive circuit pattern embedded in and integral with an insulator materil substrate, such that the surface of the conductive circuit pattern is exposed along one surface of the substrate, and lays flush and coplanar with therewith. At least two of said boards are stacked with a layer of insulator material interposed between each pair of adjacent boards. The entire assembly is heat-pressed together to form a homogenous block of insulator material having conductive circuit patterns embedded and integrally molded therein.
Claims11
A method for fabricating multiple layer printed circuit board packages, comprising the steps of:
- (a) fabricating a plurality of printed cirucit board layers, wherein each layer if formed by embedding a conductive circuit pattern in an insulator material base such that the exposed surface of the pattern lays flush and coplanar with the surface of the base, and wherein said conductive circuit patterns are treated with a chemical conversion coating to provide an enhanced bond between said conductive circuit patterns and the insulator material bases in which they are embedded;
- (b) stacking a plurality of said circuit board layers on top of each other;
- (c) placing a layer of insulator material between each of said stacked printed circuit board layers;
- (d) bonding the stack of circuit boards and interposed layers of insulator material together to form a multiple layer printed circuit board package.
Dependencies are inferred from the claim text.