Back to results
US 4,788,765 AGranted
Method of making circuit assembly with hardened direct bond lead frame
AssigneeGentron Corporation
InventorsLance R. Kaufman, John A. Dombeck, Herbert O. Frederickson
Life of this patent
Estimating the term…
Abstract
In an electric circuit assembly (2) having conductive lead frames (8-10) directly bonded to an insulating substrate (6) by a eutectic, the lead frames are further subjected to a work hardening step (32, 34) to stiffen the lead frames and enable push-on fastener connection (12) to the lead frames without collapse thereof.
Claims7
A method of making an electric circuit assembly comprising:
- providing an electrically insulting thermally conductive nonmetallic refractory substrate;
- providing electrically conductive metallic lead frame means;
- directly bonding said lead frame means to said substrate by placing said lead frame means in contact with said substrate, heating said lead frame means and said substrate to a temperature below the melting point of said metallic lead frame means to form a eutectic with said lead frame means which wets said lead frame means and said substrate, and cooling said lead frame means and said substrate with said lead frame means bonded to said substrate;
- work hardening said lead frame means to stiffen said lead frame means and enable push-on fastener connection to said lead frame means without collapse thereof.
1 more element
Dependencies are inferred from the claim text.