Semiconductor device and method of producing semiconductor device

A method of producing a semiconductor device comprising the steps of:

• mounting a semiconductor element on a stage, the stage being connected to a lead frame via a stage bar, the lead frame having a plurality of leads extending therefrom, portions of the leads in a vicinity of the stage being isolated from the stage and the stage bar;
• providing a plurality of wires connecting terminals of the semiconductor element to corresponding ones of the leads;
• molding an inner resin package portion over the stage, the semiconductor element, the wires, and a portion of the stage bar and portions of the leads in a vicinity of the stage;
• cutting at least a portion of the stage bar between the inner resin package portion and the lead frame;
• molding an outer resin package portion over the inner resin package portion, portions of the remaining portions of the leads and the exposed stage bar from the inner resin package portion, so that a free tip end of the stage bar extending from the stage is located inside the outer resin package portion;
• and
• cutting and removing unwanted portions of the lead frame.

A method of producing a semiconductor device comprising the steps of:

• mounting a semiconductor element on a stage, the semiconductor element having a plurality of wires extending therefrom, the stage being connected to a lead frame via a stage bar, the lead frame having a plurality of leads extending therefrom and respectively connected to the wires extending from the semiconductor element;
• forming an inner resin package portion over the stage, the semiconductor element, the wires, a portion of the stage bar, and portions of the leads adjacent to the wires;
• removing at least a portion of the stage bar between the inner resin package portion and the lead frame;
• and
• forming an outer resin package portion over the inner resin package portion, portions of the remaining exposed portions of the leads, and a free end tip of the stage bar extending from the inner resin package portion, so that the free tip end of the stage bar extending from the stage is located inside the outer resin package portion and isolated from the leads by the inner resin package portion and the outer resin package portion.

A semiconductor device comprising:

• a stage;
• a semiconductor element mounted on said stage;
• a stage bar extending from said stage, said stage bar having a base end connected to said stage and a free tip end;
• a plurality of wires extending from said semiconductor element;
• a plurality of leads respectively connected to said plurality of wires;
• and
• a resin package including:
• an inner resin package portion for sealing said stage, said semiconductor element, said wires, a portion of said stage bar, and portions of said leads adjacent said wires;
• and
• an outer resin package portion for sealing said inner resin package portion, portions of the remaining exposed portions of said leads, and said free tip end of said stage bar, said stage bar being isolated from said leads by said inner and outer resin package portions.