Eletronic endoscope with an imaging device having side bonding pads
AssigneeOlympus Optical Co., Ltd.
InventorHisao Yabe
Life of this patent
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Abstract
An electronic endoscope, equipped with an imaging apparatus having side bonding pads, is provided with a flexible insertable part which is formed to be small in diameter. Within a tip of the insertable part, a solid state imaging device is formed and a solid state imaging chip is provided with chip side bonding pads. The solid state imaging chip is secured to a base provided with base side bonding pads in groups. The chip side bonding pads and base side bonding pads are connected respectively with each other through bonding wires. The chip side bonding pads are provided on one side of the image area in a plurality of rows.
Claims18
An electronic endoscope comprising:
- an operating part;
- a flexible insertable part formed to have a diameter which is smaller than a diameter of the operating part;
- contents of said flexible insertable part including at least a light guide arranged over an entire length within said insertable part;
- a solid state imaging device provided within a tip of said insertable part, provided substantially at right angles with an axial direction of the insertable part and provided in a space enclosed with an inside diameter of the insertable part and said contents;
- a solid state imaging chip forming said solid state imaging device and having an image area and chip side bonding pads provided along one side of said image area;
- a base securing said solid state imaging chip;
- base side bonding pads provided in groups on said base;
- and
- bonding wires connecting said chip side bonding pads and base side bonding pads respectively with each other.
Dependencies are inferred from the claim text.