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US 4,786,569 AGranted
Adhesively bonded photostructurable polyimide film
AssigneeCiba-Geigy Corporation
InventorsOttmar Rohde, Armin Schaffner
Life of this patent
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Abstract
Coated material containing in successive order (a) a substrate, (b) a photostructurable negative-working thermostable adhesive and (c) a self-supporting photocrosslinkable polyimide film. This arrangement can be used for producing relief images by means of photolithographic processes.
Claims49
A process for preparing relief images by means of a photolithographic process, comprising the following steps:
- (i) coating a substrate surface with a photostructurable negative-working thermostable adhesive
- (ii) applying a self-supporting photostructurable polyimide film to the adhesive-coated surface,
- (iii) image-wise exposure of the arrangement with actinic radiation from the side of the polyimide film or of the substrate, and
- (iv) developing the system with a suitable developer in order to remove in the unexposed areas both the polyimide film and the adhesive film.
1 more element
A process for preparing relief images by means of photolithographic process, comprising the following steps:
- (i) coating a substrate surface with the adhesive side of a two-layer system comprising photostructurable negative-working thermostable adhesive and self-supporting photostructurable polyimide film,
- (ii) image-wise exposure of the arrangement with actinic radiation from the side of the polyimide film or of the substrate and
- (iii) developing the system with a suitable developer in order to remove in the unexposed areas the polyimide film and the adhesive film.
Dependencies are inferred from the claim text.