Electrodeposition without internal deposit stress
AssigneeThe United States of America as represented by the Secretary of the Air Force
InventorLuther E. Vaaler
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AssigneeThe United States of America as represented by the Secretary of the Air Force
InventorLuther E. Vaaler
Estimating the term…
An apparatus and method are described for electrodepositing an electroform with near zero internal stress. A voltage controlled power supply supplies current to both a mandrel, upon which a primary electroform is deposited, and to a deformable thin disk substrate, upon which a secondary deposit is formed. A strain gage on the deformable substrate measures any deformation caused by internal stress in the secondary deposit. The strain gage is connected to a strain gage transducer to produce an output signal to a proportional controller. The proportional controller in turn supplies a strain-proportional voltage signal to the power supply. A current mask ensures an even current density over the mandrel. After initially adjusting electroforming bath parameters to provide a zero internal stress in the starting electroform, the output from the strain gage causes proportional changes in the bath current to the mandrel to maintain a constant near zero internal stress in the primary electroform.
An apparatus for electroforming a first electrodeposit onto a rigid mandrel with minimum internal stress during its formation, the mandrel and anode means immersed inside a metal-containing bath;
A method for electroforming a first electrodeposit onto a rigid mandrel with minimum internal stress during its formation, the mandrel and anode means immersed inside a metal-containing bath;
Dependencies are inferred from the claim text.