Low profile modular receptacle and method of making same
AssigneeHayes Microcomputer Products, Inc.
InventorRoger L. Paul
Life of this patent
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AssigneeHayes Microcomputer Products, Inc.
InventorRoger L. Paul
Estimating the term…
A low profile modular telephone receptacle (15) is shown. A unitary housing (16) having a pair of transverse support members (35, 36) is provided. A top plate (17) having the necessary plurality of conductors (20) embedded therein is also provided. During assembly, the ends (22, 25) of the conductor are bent to predetermined angles (62, 65) and the top plate is joined to the bottom plate by ultrasonic welding. The resultant receptacle is one in which a minimum height dimension (h) above the necessary height dimension of the opening (18) to accept a standard modular plug is provided. In the preferred method of construction, the top plates (17) are injection molded onto continuous strands of filaments to form the conductors (20). A plurality of slots (55, 56) are provided at one end of the top plate to guide the conductors corresponding openings (46) in the bottom plate when the ends of the conductors forming a terminal set for connecting the receptacle to a utilization circuit are fabricated.
A low profile modular receptacle for modular telephone plugs comprising in combination:
A method of constructing a modular receptacle comprising the steps of:
Dependencies are inferred from the claim text.