Electronic component with lead terminals and method of manufacturing said electronic component

A method of manufacturing an electronic component including lead terminals respectively connected to electrodes formed on opposite end faces of an electronic component element, said method comprising the steps of

• preparing a metallic plate having predetermined width and length,
• forming a plurality of openings elongated in the widthwise direction of the metallic plate and arranged at equal intervals along a lengthwise direction of said metallic plate,
• thereafter, forming a film of a metallic material superior in soldering and oxidation preventing properties over the surface of said metallic plate,
• cutting said metallic plate in the widthwise direction through each of said elongated openings so as to form narrow lead plates each having large width portions respectively at opposite ends thereof,
• bending each of said lead plates approximately at its central portion into a U-shape so that said large width portions thereof confront each other,
• causing said lead plate to be held on a holder member in a tape-like configuration in such a manner that opposite side portions of the bent portion of said lead plate are directed generally at right angles with the longitudinal direction of said holder member, and
• then, inserting the electronic component element between the confronting large width portions of the lead plate so that said large width portions contact said electrodes of said electronic component element for electrical connection.