Semi-conductor I.C. element
AssigneeCanon Kabushiki Kaisha
InventorsTakao Kinoshita, Shinji Sakai, Takashi Kawabata, Nobuhiko Shinoda, Kazuya Hosoe
Life of this patent
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Abstract
In a monolithic sensor IC, the light sensing element is formed on a base plate and a light-absorber coating such as black paint is provided on the surface of the semiconductor at positions other than the light path to the light sensing element, with the surface of the light-sensing element being provided with a reflection-prevention coating and with the entire sensor being housed within a package, the inside of the package of the IC also being provided with light-absorbing black paint.
Claims12
An image pickup device comprising:
- (a) photoelectric transducing means having a photoelectric transducing surface for converting light information into an electrical signal;
- (b) a package having said photoelectric transducing means sealed therein, said package having at least a part of the walls thereof made of a light-transmitting optical element to have incident light impinge on said photoelectric transducing surface through said optical element, said light-transmitting optical element having a surface opposed to said photoelectric transducing surface;
- and
- (c) light absorbing means containing a substance of high light-absorbing efficiency for absorbing the light reflected on the inside of said package,
- said light absorbing means covering said opposed surface of the light-transmitting optical element except a predetermined portion opposing to the photoelectric transducing surface, said portion having approximately the same size as said photoelectric transducing surface.
An image pickup device, comprising:
- (a) photoelectric transducing means having a photoelectric transducing surface of predetermined area for converting light information into an electrical signal;
- (b) a package having said photoelectric transducing means sealed therein, said package having a wall made from a light-transmitting optical element, said wall having an opposing surface to said photoelectric transducing surface, said opposing surface being larger than said photoelectric transducing surface;
- and
- (c) light absorbing means arranged between said wall and said photoelectric transducing means for absorbing light reflected on an inside of said package, said light absorbing means having an opening for allowing light to pass through said wall to said photoelectric transducing surface and having substantially a same size as said photoelectric transducing surface.
Dependencies are inferred from the claim text.