Novel nickel/indium/other metal alloy for use in the manufacture of electrical contact areas of electrical devices

An improved electrical device of the type having electrical contact areas for providing electrical connection between said device and other electrical device the improvement comprises electrical contact areas electroplated with an alloy consisting essentially of from about 0.1 to 99 weight percent nickel, from about 0.1 to about 75 weight percent indium and about 0.1 to about 20 weight percent of one or more other metal selected from the group consisting of zinc, copper, gold, lead, silver, rhodium, germanium, ruthenium, rhenium, platinum, palladium, tin, iridium, antimony, gallium, bismuth, cadmium, osmium and arsenic.

In an improved hermetic sealing cover for hermetically sealing a container for one or more electronic devices, said improvement comprising a cover plated with a nickel based alloy which consisting essentially of from about 0.1 to about 99 weight percent nickel, from about 0.1 to about 75 weight percent indium and from about 0.1 to about 20 weight percent of one or more other metals selected from the group consisting of zinc, copper, gold, lead, silver, rhodium, germanium, ruthenium, rhenium, platinum, palladium, tin, iridium, antimony, gallium, bismuth, cadmium, osmium, and arsenic.

In an improved hermetically sealed container for electronic devices of the type comprising a body with a cavity having an opening, means for supporting one or more electronic devices, one or more electronic devices supported by said supporting means, and hermetic sealing means in hermetically sealing engagement with said opening, the improvement comprising hermetic sealing means which comprises a conductive cover element plated with a nickel based alloy disposed in registry with said opening and hermetically sealed thereto said alloy consisting essentially of from about 0.1 to about 99 weight percent nickel, from about 0.1 to about 75 weight percent indium and from about 0.1 to about 20 weight percent of one or more other metals selected from the group consisting of zinc, copper, gold, lead, silver, rhodium, germanium, ruthenium, rhenium, platinum, palladium, tin, iridium, antimony, gallium, bismuth, cadmium, osmium and arsenic.