Method of joining beam leads with projections to device electrodes

A method of manufacturing a semiconductor device which includes a semiconductor member having a semiconductor and electrodes, and beam leads, comprising the steps of:

• electro-plating an open pattern of electrically conductive material forming a plurality of spaced beam leads having respective projections, onto a substrate with the projections being formed at locations on the substrate corresponding to the locations of electrodes of a semiconductor member;
• after said step of electro-plating, positioning the semiconductor member so that the locations of the electrodes are aligned with the corresponding locations of the projections;
• after said step of positioning, pressing the electrodes against the projections so as to thereby join the electrodes to the lead beams at the projections;
• after said step of pressing, moving the semiconductor member with the electrodes thereof and the lead beams joined to the electrodes away from the substrate so as to thereby separate the beam leads from the substrate to provide a first semiconductor device;
• and
• after said step of pressing, repeating said steps of electro-plating, positioning, pressing and moving using the same substrate, to provide a second semiconductor device.

A method of manufacturing semiconductor devices which includes a semiconductor member having a semiconductor and electrodes, and a beam lead, comprising the steps of:

• electro-plating electrically conductive material forming a plurality of spaced beam leads having respective projections, onto openings formed on a substrate, with the projections being formed at locations on the substrate corresponding to the locations of electrodes of a semiconductor member;
• after said step of electro-plating, positioning the semiconductor member so that the locations of the electrodes are aligned with the corresponding locations of the projections;
• after said step of positioning, pressing the electrodes against the projections so as to thereby join the electrodes to the beam leads at the projections;
• after said step of pressing, moving the semiconductor member with the electrodes thereof and the beam leads joined to the electrodes away from the substrate so as to thereby separate the beam leads from the substrate to provide a first semiconductor device;
• and
• after said step of pressing, repeating said steps of electro-plating, positioning, pressing and moving using the same substrate, to provide a second semiconductor device.

A method of manufacturing a semiconductor device which includes a semiconductor member having a semiconductor and an electrode, and a beam lead, comprising the steps of:

• providing a substrate;
• using a single process to concurrently form a lead portion and a projection of a beam lead on the substrate,
• the projection extending from the lead portion, disposed on the substrate and projecting from the substrate;
• aligning the beam lead with an electrode of a semiconductor member;
• after said step of aligning, pressing the electrode against the projection so as to thereby join the electrode to the beam lead;
• and
• after said step of pressing, moving the semiconductor member with the electrode thereof and the lead beam joined to the electrode away from the substrate so as to thereby separate the beam lead from the substrate.