Polysilicon fluid bed process and product
AssigneeEthyl Corporation
InventorsMarcelian F. Gautreaux, Robert H. Allen
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AssigneeEthyl Corporation
InventorsMarcelian F. Gautreaux, Robert H. Allen
Estimating the term…
Silicon of high purity is used in making semiconductor devices. Silicon for this purpose is made by decomposing silane in a fluidized bed reactor. This process entails thermal decomposition of silane to deposit additional metallic silicon on particles of high purity silicon. To obtain good process economics, two modes of operation are used. In a first mode, the reactor is operated under high productivity conditions which also result in co-production of silicon dust or fines. Some of the dust is deposited on the product silicon particles and some of it is elutriated by gas flow in the reactor and removed through an exit point near the top of the reactor apparatus. The dust on the particles can cause problems in handling. For example, in bagging the particles, or removing the particles from a bag, the dust can become airborne from the larger particle surfaces and form an objectionable cloud of silicon dust. The invention provides a method for uniting dust to the larger silicon particles, and also provides the improved silicon particles produced by the process. The improvement comprises a second mode, viz depositing a thin (0.1-5.0 micron) layer of high purity silicon on the dust laden particles. This second mode is most preferably carried out by (a) treating the dust-laden particles with a deposition gas comprising 1 to 5 mole % silicon admixed with an inert carrier gas such as hydrogen, (b) in a fluidized bed reactor, and (c) at a process temperature of 620.degree.-650.degree. C. By this method the amount of readily removable dust can be considerably reduced, forming an improved product tht is better suited for commerce. The process can be extended to the use of other silicon-containing gases such as dichlorosilane and trichlorosilane by selecting reaction conditions suitable for use with those substances.
A process for preparing particulate polysilicon having a reduced amount of silicon dust on surfaces thereof, said process comprising:
A process for reducing the mount of silicon dust on the surface of particulate silicon particles, said particles (i) having a size range of from about 400 to about 1000 microns and (ii) having a surface dust content greater than about 0.1 weight percent, said process comprising contacting said particles in a fluidized bed with a deposition gas comprising 1 to 5 mole percent silane at a temperature between the thermal decomposition temperature of silane and the melting point of silicon, to deposit on said particle surfaces a layer of metallic silicon of from about 0.1 to about 5 microns, and thereby cement surface siliocn dust to said particles.
In a process for produoing particulate silicon by thermal decomposition of a vaporous silicon-containing compound in a fluidized bed, the improvement which comprises reducing the amount of silicon dust in the product by fluidizing (a) a particulate silicon having a size range of from about 400 to 1000 microns with (b) a gaseous stream comprising from about 1 to about 5 mole percent silane in hydrogen, at from about 620.degree. to about 650.degree. C.;
A process of producing elemental silicon, said process comprising the steps of intimately contacting
Dependencies are inferred from the claim text.