Method for screen printing solder paste onto a substrate with device premounted thereon
AssigneeGeneral Motors Corporation
InventorsDavid B. Metzger, Glenn S. Johnson, Michael D. Bramel
Life of this patent
Estimating the term…
Abstract
A printing screen for screen printing fabrication substances such as solder paste has an aperture formed therein so that the screen may be placed on a substrate surface with a pre-mounted device extending through the aperture. A metal cap is bonded to the screen over the pre-mounted device to protect the device against damage during a subsequent screen printing operation. Different elements may, therefore, be bonded to a substrate in completely independent steps without the need for fluxing operations in later bonding operations.
Claims2
A method of manufacturing electrical circuit devices of the type including a substrate having at least two elements solder-bonded to a common surface thereof comprising the successive steps of:
- (a) screening a solder-flux mixture onto a first area of the substrate surface;
- (b) placing a first element on the screened-on solder-flux mixture;
- (c) fusing the solder-flux mixture to bond the first element to the substrate;
- (d) screening a solder-flux mixture onto a second area of the substrate surface by means of a screen having a covered aperture generally conforming with the first element;
- (e) placing a second element on the screened-on solder-flux mixture on the second area;
- and
- (f) heating the combination of substance, bonded first element, second element, and latter solder-flux mixture to fuse the latter solder-flux mixture and thereby bond the second element to the substrate.
Dependencies are inferred from the claim text.