Soldering machine with cooled guide profiles

A soldering machine for soldering objects, comprising a fluxer for applying flux to an object, a preheater for preheating the object, a solder bath for applying solder to the object, the fluxer, preheater and solder bath lying in succession in a transport direction for the object, a fixed guide profile extending parallel to the transport direction adjacent the fluxer, preheater and solder bath, an adjustable guide profile extending parallel to the transport direction adjacent the fluxer, preheater and solder bath, said adjustable guide profile being spaced by a variable amount from the fixed guide profile in a direction across the transport direction for adjusting the distance between the fixed and adjustable guide profiles, each guide profile including at least one coolant conduit extending therethrough in the transport direction, and pump means operatively connected to the conduits of the fixed and adjustable guide profiles for pumping coolant through the conduits to cool the guide profiles, each guide profile comprises a profile rod which carries said conduit therein, a pair of chain guides fixed to opposite sides of said profile rod, a roller chain having guide bushings guided in said chain guides for revolving around said profile guide, and a plurality of solder fingers connected to said roller chain and sliding along opposite sides of said guide profile, an object to be soldered being engageable between the soldering fingers of said fixed guide profile and the soldering fingers of said adjustable guide profile.