Far ultraviolet surgical and dental procedures
AssigneeInternational Business Machines Corporation
InventorsSamuel E. Blum, Rangaswamy Srinivasan, James J. Wynne
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AssigneeInternational Business Machines Corporation
InventorsSamuel E. Blum, Rangaswamy Srinivasan, James J. Wynne
Estimating the term…
A method and apparatus are described for photoetching organic biological matter without requiring heat as the dominant etching mechanism. Far-ultraviolet radiation of wavelengths less than 200 nm are used to selectively remove organic biological material, where the radiation has an energy fluence sufficiently great to cause ablative photodecomposition. Either continuous wave or pulse radiation can be used, a suitable ultraviolet light source being an ArF excimer laser having an output at 193 nm. The exposed biological material is ablatively photodecomposed without heating or damage to the rest of the organic material. Medical and dental applications include the removal of damaged or unhealthy tissue from bone, removal of skin lesions, cutting or sectioning healthy tissue, and the treatment of decayed teeth.
A method for removing selected areas of a biological layer comprised of organic material, including the steps of:
A method for selectively removing portions of a biological layer comprised of an organic material, comprising the steps of:
A method for removing a selected amount of a biological layer comprised of organic material, including the steps of:
A method for removing a portion of a biological layer comprised of protein organic material, comprising the step of:
A method for removing a portion of a protein biological layer to a desired depth, comprising the steps of:
A method for etching a biological sample to an optically visible depth, comprising the steps of:
Dependencies are inferred from the claim text.