Method of forming a blind solder joint in an ignition coil
AssigneeUnited Technologies Automotive, Inc.
InventorsJames F. Fernquist, Donald E. Ellison
Life of this patent
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Abstract
A method of forming a solder joint between a cup shaped high voltage terminal and a secondary lead extending from a secondary coil within a plastic case of an ignition coil. The steps include securing a solder paste to an inwardly extending end of the high voltage terminal, positioning the secondary coil lead relative to the solder paste, and heating the joint without making physical contact therewith to promote melting of the solder to secure and electrically connect the desired components.
Claims12
A method of forming a solder joint between a cup shaped high voltage terminal to be inserted within a high voltage opening in a plastic case of an ignition coil and a projecting secondary lead extending from a secondary coil inserted within a main opening in the case which comprises the steps of:
- securing an adherent solder paste to the inwardly extending end of the high voltage terminal;
- positioning the high voltage terminal within the high voltage opening in the case of the ignition coil with the inwardly extending end projecting to the main opening in the case;
- placing the secondary coil in the main opening of the case with the secondary lead positioned to contact the solder paste secured to the high voltage terminal;
- and
- heating the inwardly extending end of the high voltage terminal, the secondary lead and the solder paste to melt the solder paste to form a solder joint therebetween, said heating being accomplished without applying physical pressure to the high voltage terminal.
A process for electrically connecting the inwardly extending end of a cup shaped high voltage terminal secured within a case to a projecting lead from a secondary coil also secured within the case, said case having a main opening extending in a first direction in which the secondary coil is secured and a high voltage terminal opening projecting in an opposite direction in which the high voltage terminal is secured, said projecting lead and said high voltage terminal being positioned adjacent each other within the interior of the case which comprises the steps of:
- affixing an adherent low melting temperature solder paste to the inwardly extending end of the high voltage terminal;
- positioning the high voltage terminal within the high voltage terminal opening with the inwardly extending end positioned to be electrically engaged by the projecting lead from the secondary coil to be positioned within the case;
- placing the secondary coil within the main opening of the case with the projecting lead positioned adjacent the inwardly extending end of the high voltage terminal;
- and
- melting the solder paste to form a solder joint between the projecting lead and the high voltage terminal by using noncontact heating means.
Dependencies are inferred from the claim text.