US 4,783,899 AGranted

Method of mounting heat sinks

AssigneeThermalloy Incorporated

InventorLeonard S. Breese

Life of this patent

Estimating the term…

Loading patent…

Abstract

Disclosed is a compensating roll pin securing a heat sink to a circuit board. The roll pin comprises a deformable body of resilient material, such as annealed spring steel, formed into a generally cylindrical body having first and second end portions separated by a middle portion of enlarged external diameter and an axially extending gap in the surface of the body. A method of use is also disclosed wherein the first end portion of the roll pin is inserted into an aperture in a heat sink and the middle portion deformed within the aperture to form a tight fit between the pin and heat sink. A substantial part of the middle portion remains outside the aperture in the heat sink. The second end portion is inserted into a hole in a circuit board and forms an interference fit therewith. The middle portion forms a stop to prevent further insertion of the roll pin into the circuit board so that a gap of predetermined distance separates the heat sink and circuit board to enhance cooling.

Claims4

Dependent claims

The method of mounting a heat sink having an aperture of first predetermined diameter therein on a circuit board having a hole of second predetermined diameter therein comprising steps of:

(a) inserting the first end of a roll pin into said aperture, said roll pin comprising an elongated hollow cylindrical body having an axially extending gap in the surface thereof and a first end portion, a second end portion and middle portion intermediate said first and second end portions with the external diameter of said middle portion larger than the external diameter of said end portions;
(b) urging the middle portion of said roll pin into the aperture sufficiently to cause said middle portion to deform and provide a tight fit between the roll pin and the heat sink with a substantial part of the middle portion extending from said aperture;
and
(c) inserting the second end portion of said roll pin into said hole in the circuit board and forming an interference fit with said hole in the board when said middle portion of said roll pin contacts the circuit board, thereby spacing the heat sink a predetermined distance from the circuit board.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 07/126,822Filed 30 Nov 1987 · division
Priority: 24 Aug 1984
Granted: 15 Nov 1988
Term ends: Not estimatedThe source records don’t support an estimate.

Classification6 codes

H10W 40/60
Arrangements for thermal protection or thermal control: securing means for detachable heating or cooling arrangements, e.g. clamps
Y10T 29/49945
Assembling or joining: by driven force fit
Y10T 29/49947
Assembling or joining: by applying separate fastener
Y10T 403/55
Joints and connections: member ends joined by inserted section