Method of manufacturing an ultrasonic transducer

A method of manufacturing an ultrasonic transducer, comprising:

• a conductive pattern formation step of forming a first electrode and a first lead conductor integral with a first flexible substrate on a surface thereof, said first lead conductor extending along the surface of said first flexible substrate starting from a side edge of said first electrode, and forming a second lead conductor having an electrode contact portion at one end thereof on a second flexible substrate;
• a second electrode formation step of depositing a second electrode on a first main surface of a piezoelectric member formed from a piezoelectric polymer material or a piezoelectric polymer composite;
• a bonding step of bonding said first electrode to a second main surface of said piezoelectric member by applying an adhesive to a surface of said first electrode, and bonding said electrode contact portion to an edge portion of said second electrode by applying an adhesive to a surface of said second flexible substrate adjacent said electrode contact portion;
• said second flexible substrate being formed as a part of said first flexible substrate, and said bonding step further comprising a folding step of folding said second flexible substrate onto said first flexible substrate with said piezoelectric member interposed therebetween;
• and
• a polarizing step of polarizing said piezoelectric member at least by applying a voltage across said first and second electrodes.

A method of manufacturing an ultrasonic transducer, comprising:

• a polarizing step of arranging first and second conductive plates so as to cover opposing first and second main surfaces of a piezoelectric member formed from a piezoelectric polymer material or a piezoelectric polymer composite, and polarizing said piezoelectric member at least by applying a predetermined voltage across said first and second conductor plates;
• a single conductive pattern formation step which comprises forming a first electrode and a first lead conductor integral with a first flexible substrate on a surface thereof, said first lead conductor extending along the surface of said first flexible substrate starting from a side edge of said first electrode, and forming a second electrode and a second lead conductor integral with a second flexible substrate on a surface thereof, said second lead conductor extending along the surface of said second flexible substrate starting from a side edge of said second electrode;
• said second flexible substrate being formed as a part of said first flexible substrate, and said bonding step further comprising a folding step of folding said second flexible substrate onto said first flexible substrate with said piezoelectric member interposed therebetween;
• and
• a bonding step of bonding said first and second electrodes to the opposing first and second main surfaces of said piezoelectric member by applying an adhesive to a surface of said first electrode and to a surface of said second electrode.

A method of manufacturing an ultrasonic transducer, comprising:

• a conductive pattern formation step of forming a first electrode and a first lead conductor integral with a first flexible substrate on a surface thereof, said first lead conductor extending along the surface of said first flexible substrate starting from a side edge of said first electrode, and forming a second lead conductor having an electrode contact portion at one end thereof on a second flexible substrate;
• a second electrode formation step of depositing a second electrode on a first main surface of a piezoelectric member formed from a piezoelectric polymer material or a piezoelectric polymer composite;
• a polarizing step of arranging a conductive plate so as to cover a second main surface of said piezoelectric member, and polarizing said piezoelectric member at least by applying a predetermined voltage across said conductor plate and said second electrode;
• said second flexible substrate being formed as a part of said first flexible substrate, said bonding step further comprising a folding step of folding said second flexible substrate onto said first flexible substrate with said piezoelectric member interposed therebetween;
• and
• a bonding step of bonding said first electrode to a second main surface of said piezoelectric member by applying an adhesive to a surface of said first electrode, and bonding said electrode contact portion to an edge portion of said second electrode by applying an adhesive to a surface of said second flexible substrate adjacent and electrode contact portion.