Cooling system for an electronic circuit device
AssigneeFujitsu Limited
InventorsHaruhiko Yamamoto, Masahiro Suzuki, Yoshiaki Udagawa, Mitsuhiko Nakata, Koji Katsuyama, Izumi Ono, Shunichi Kikuchi
Life of this patent
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Abstract
A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coolant, and means for guiding and preventing improper alignment of the transfer plate as the same is resiliently biased toward the circuit component. The coolant module may include a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.
Claims9
In an electronic circuit device including a printed circuit board having thereon at least one electronic circuit component, a cooling system including a cooling module comprising a conduit for coolant flow, a heat transfer plate exposed to the flow of the coolant for transferring the heat dissipated from the circuit component to the coolant, elastic means connected to the heat transfer plate for resiliently biasing the heat tranfer plate toward the circuit component, and rigid guide means connected to the conduit and closely surrounding said heat transfer plate for guiding and preventing improper alignment of the heat transfer plate.
In an electronic circuit device including a printed circuit board having thereon a plurality of electronic circuit components, a cooling system comprising a respective cooling module for each circuit component, and a conduit means common to the cooling modules, in which conduit means a coolant flows, each cooling module comprising a heat transfer plate exposed to the flow of the coolant for transferring the heat dissipated from the corresponding circuit component to the coolant, an elastic means connected to the heat transfer plate for resiliently biasing the heat transfer plate toward its corresponding circuit component, and a respective rigid guide means connected to the conduit means and closely surrounding said heat transfer plate for guiding and preventing improper alignment of the heat transfer plate.
Dependencies are inferred from the claim text.