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US 4,782,589 AGranted
Process of connecting lead frame to a semi-conductor device and a device to effect same
OwnerRichard K. Dennisinventor
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OwnerRichard K. Dennisinventor
Estimating the term…
A lead frame having opposite rows of leads to be connected to the edges of a semi-conductor device and heads on one end of the leads provided with similar angularly related legs between which the edges of the device are received for ultimate soldered connection thereto, the leads and corresponding heads respectively extending from opposite sides of an elongated supporting strip connected at the ends thereof to the lead frame adjacent recesses in the frame to permit bending of the rows of leads substantially along the axis of the supporting strip and thereby extend the heads of the leads upwardly to cause the uppermost legs of the heads of opposite rows thereof to be spaced apart a distance greater than the width of the device to be connected thereto while the ends of the rows of lowermost legs of the heads are spaced a distance less than the width of the device to be supported thereon prior to the rows of leads being reversely bent to restore the bent leads and heads thereon to the plane of the frame and thereby cause the opposite rows of uppermost legs to be extended toward each other adequately to overlie the edges of the device and in conjunction with the lowermost legs of the heads secure the device between the rows of heads. The invention also includes a process for accomplishing the foregoing results and a forming device to achieve the same.
A method of mounting geometric semiconductor devices respectively upon similar lead frame units connected to each other in strip form and each unit having at least an opposed pair of rows of similar leads on opposite sides of a central opening in each frame unit, said leads having on one end heads comprising a pair of similar legs evenly bent into fork-like configurations and the distance between the ends of said legs on said opposite rows thereof being less than the transverse dimension of said semi-conductor devices to be supported between said rows of heads, said rows of leads being connected integrally intermediately of the ends thereof by an elongated connecting strip, the ends of said strip are connected to portions of said lead frame by bendable portions of said lead frame adjacent opposite ends of said connecting strip, said method comprising the steps of:
Forming mechanism operable to position uniform semi-conductor devices successively with central openings in lead frame units fed stepwise to said mechanism and said units having at least one pair of parallel rows of headed leads respectively on opposite sides of said central opening therein, said leads also being connected integrally intermediately of the ends thereof to an elongated connecting strip and the opposite ends of said strip being integral with said lead frame units, said mechanism comprising respective generally similar supporting and clamping members having central openings similar to that of said lead frame units and alignable with said central opening of said lead frame unit, said supporting and clamping members having transversely spaced surfaces engageable respectively with opposite surfaces of the portions of said lead frame units which are adjacent the corners of said central opening therein, the headed ends of said leads of said lead frame units and at least portions of said connecting strips extending into the aligned central openings of said supporting and clamping members, and similar elongated narrow bending members movable axially within said aligned central openings of each of said supporting and clamping members when clamping a frame unit therebetween and engaging the portions of said lead frame units which are immediately adjacent the opposite ends of said connecting strips and which also extend into said openings for engagement by said bending members initially to bend said portions of said frame through a limited angle about edges of the opening of said clamping member to extend the headed ends of said leads upwardly within said openings in position to receive a semi-conductor device, and subsequently engage said bent portions of said frame which are adjacent said opposite ends of said connecting strips with a second of said bending members to restore the headed ends of the leads to the plane of said frame and thereby secure said device between the heads of opposite rows thereof.
Dependencies are inferred from the claim text.