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US 4,779,835 AGranted
Mold for transfer molding
AssigneeSony Corporation
InventorsYuichi Fukushima, Fujio Kobayashi, Shinichiro Takahashi
Life of this patent
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Abstract
A mold for transfer molding having a cavity block in which a mold injected with resin is formed and a templet for holding the cavity block, in which a liquid layer is provided between the templet and a support member for supporting the templet, whereby the templet can be moved up and down on the liquid layer at its respective portions.
Claims2
A mold for transfer molding having a cavity block in which a mold injected with a resin is formed comprising:
- (a) a templet mounted to the mold for holding the cavity block;
- (b) a support member having a plurality of cylinders therein for supporting the templet, the cylinders being disposed on the templet;
- and
- (c) means for providing an actuating fluid to the cylinders.
1 more element
Dependencies are inferred from the claim text.