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US 4,771,260 AGranted
Wire bonded microfuse and method of making
AssigneeCooper Industries, Inc.
InventorLeon Gurevich
Life of this patent
Estimating the term…
Abstract
A microfuse (10) with a ceramic chip (12), thick film pads (14), fusible wire (16), attached to pads (14) without solder or flux, ceramic coating (18) and plastic body (20). External lead (24) configuration can be axial, radial or surface mount. The method of manufacturing the fuse (10) is improved by utilizing a wire bonding technique in order to improve the quality of the manufacturing process and increase the reliability in performance of the fuse and reduce manufacturing cost.
Claims17
A fuse element subassembly comprising:
- an insulating ceramic substrate;
- metallized areas on both ends of said substrate;
- a fusible element attached to said metallized areas in a manner not employing solder or flux;
- and
- wherein an arc quenching material covers at least a portion of said substrate, metallized areas, and all of the fusible element;
- and
- wherein said arc quenching material is ceramic.
4 more elements
A fuse comprising;
- an insulating substrate;
- metallized areas on both ends of said substrate;
- a fusible element attached to said metallized areas in a manner not employing solder or flux;
- and
- one lead attached to each of said metallized areas in a manner not employing solder or flux.
2 more elements
Dependencies are inferred from the claim text.