Highly heat-sensitive film for stencil

A highly sensitive stencil sheet excellent in low-energy perforation property, which stencil sheet comprises a film 0.5 to 15 .mu.m in thickness consisting of a thermoplastic resin having a coefficient of temperature and melt viscosity (.DELTA.T/.DELTA. log VI) of not more than 100 and exhibiting a thermal shrinkage (X%) at 100.degree. C. and a thermal shrinkage stress (Y g/mm.sup.2) respectively falling in the ranges of the formulas;

• 15.ltoreq.X.ltoreq.80 and 75.ltoreq.Y.ltoreq.500, and both falling in the range of the formula;
• -8X+400.ltoreq.Y.ltoreq.-10X+1000;
• and a porous supporting member permitting permeation therethrough of printing ink, avoiding substantial degeneration under heating conditions existing during the perforation of said film, and having said film laminated thereon.

A perforated film comprising a film prepared by perforating a film comprising a thermoplastic resin having a coefficient of temperature and melt viscosity (.DELTA.T/.DELTA. log VI) of not more than 100 and a thermal shrinkage (X%) at 100.degree. C. and a thermal shrinkage stress (Y g/mm.sup.2) at 100.degree. C. falling respectively in the ranges of the formulas;

• 15.ltoreq.X.ltoreq.80 and 75.ltoreq.Y.ltoreq.500;
• and both falling in the range of the formula;
• -8X+400.ltoreq.Y.ltoreq.-10X+1000, having a thickness in the range of 0.5 to 15 .mu.m, and possessing substantially discontinuous perforations 1 to 200 dots/mm at least in one direction of a perforated area.