US 4,761,306 AGranted

Method of making a positioned chip surface covering

AssigneeArmstrong World Industries, Inc.

InventorsLawrence Clark, Harold N. Graybeal, Jack H. Witman

Life of this patent

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Abstract

The present invention relates to a process for preparing chip-containing decorative surfaces wherein the chips are positioned so as to provide a pattern. A first adhesive material is selectively applied to a support surface and the conditions are adjusted so that the first adhesive material is substantially non-adhesive in nature. A second adhesive material is selectively applied as a pattern on top of or adjacent to the first adhesive material and chips are applied to the surface so as to be adhered by the second adhesive material. Any non-adhered chips are removed and the conditons are adjusted so that the first adhesive material demonstrates adhesive properties. A second type or color of chip material is then applied so as to be adhered by the first adhesive material. Upon removal of the non-adhered chips, a product is obtained having a positioned chip pattern. The process may also be practiced using additional adhesives and chips so as to provide products having more than two types of positioned chips.

Claims1

Dependent claims

A process for forming a decorative surface "comprising decorative particles";

comprising the steps of
selectively providing a first adhesive material on a support surface;
selecting a first set of environmental conditions such that said first material exhibits substantially non-adhesive properties;
selectively providing a second adhesive material on said support surface, said second material being applied on top of and/or adjacent to said first material, said second material exhibiting adhesive properties under said first conditions;
depositing a first decorative particulate chip material over the layered adhesive materials, at least a portion of said particulate material being adhered to said second material;
removing non-adhered particles from the surface of the layered composite;
selecting a second set of environmental conditions such that said first adhesive material exhibits adhesive properties;
depositing a second decorative particulate chip material different from the first over the surface of the layered composite, at least a portion of said second particulate material being adhered to said first adhesive material;
and
removing non-adhered particles from the surface of the layered composite, whereby a product is produced comprising a pattern of adhered chips.

7 more elements

Dependencies are inferred from the claim text.

Facts

Application: 06/666,295Filed 30 Oct 1984
Granted: 2 Aug 1988
Term ends: Not estimatedThe source records don’t support an estimate.

Classification13 codes

D06N 7/0023
Characterised by their relief structure: obtained by physical means, e.g. differential heating or differential irradiation; masking certain areas…
B44C 1/04
Processes, not specifically provided for elsewhere, for producing decorative surface effects: producing precipitations
B44F 1/08
Designs or pictures characterised by special or unusual light effects: characterised by colour effects
D06N 7/0007
Floor covering on textile basis comprising a fibrous substrate being coated with at least one layer of a polymer on the top surface: characterised…