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US 4,755,422 AGranted
Multilayered electronics protection system
AssigneeUnited Technologies Corporation
InventorsStephen E. Headrick, Charles E. Cataldo
Life of this patent
Estimating the term…
Abstract
A multilayered electronics protection system includes a first ablator layer providing thermal protection that is sprayed on to a non-metallic surface of an electronics enclosure. A second ablator layer comprised of highly conductive material is sprayed on to the first ablator layer and provides protection against strategic environmental threats.
Claims15
A multilayered electronics protection system affixed to a non-metallic surface enclosing electronics comprising:
- first ablator layer means applied to the non-metallic surface, bonding thereto, providing thermal protection;
- second ablator layer means applied on and adhering to said first ablator layer, including highly conductive material providing protection against strategic environmental threats and additional thermal protection.
A fibrous multilayered electronics protection system affixed to a non-metallic surface enclosing electronics hardware comprising:
- first ablator layer means applied to the non-metallic surface, bonding thereto, providing thermal protection;
- high conductivity fiber means positioned on said first ablator layer means providing protection against strategic environmental threats, and;
- second ablator layer means applied to said first ablator means and said high conductivity fiber means, bonding thereto, providing thermal protection.
Dependencies are inferred from the claim text.