Solid-state imaging apparatus and endoscope
AssigneeOlympus Optical Co., Ltd.
InventorsKoji Takamura, Haruhiko Kaiya
Life of this patent
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Abstract
An endoscope includes an operation section and an insertion section extending from the operation section. In a distal end portion of the insertion section is arranged a solid-state imaging apparatus 40 for converting an optical image imaged by an objective unit into an electric signal and outputting the signal. The imaging apparatus includes a base and a solid-state imaging element tip mounted on the base and having a light-receiving section and a plurality of electrodes. A plurality of leads are provided at the base. A transparent cover plate is fixed to the base and has a surface facing the light-receiving section. A lead pattern is formed on the surface of the cover plate and electrically connects the leads and the electrodes.
Claims11
A solid-state imaging apparatus comprising:
- a base;
- a solid-state imaging element chip mounted on the base and having a light-receiving section and a plurality of electrodes;
- a plurality of leads provided at the base;
- and
- a transparent cover fixed to the base to face the light-receiving section of the chip, the cover having a surface facing the light-receiving section and a lead pattern which is formed on the surface and electrically connects the leads and the electrodes.
An endoscope comprising:
- an operation section;
- an insertion section extending from the operation section;
- an objective optical system, arranged in a distal end portion of the insertion section, for imaging an optical image;
- and
- a solid-state imaging apparatus, arranged in the distal end portion of the insertion section, for converting the optical image imaged by the objective optical system into an electrical signal and outputting the electrical signal, said imaging apparatus comprising:
- a base;
- a solid-state imaging element chip mounted on the base and having a light-receiving section and a plurality of electrodes;
- a plurality of leads provided at the base;
- and a transparent cover fixed to the base to face the light-receiving section of the chip, the cover having a surface facing the light-receiving section and a lead pattern which is formed on the surface and electrically connects the leads and the electrodes.
Dependencies are inferred from the claim text.