Method of manufacturing cards having an electronic memory and cards obtained by performing said method

A method of providing an electronic memory card comprising a body made of a thermoplastic material and having two main faces which are substantially parallel to each other, and an electronic module comprising:

• a support which is generally flat in shape having two main faces;
• contact tabs disposed on a first one of said main faces of said support;
• a semiconductor chip having an integrated circuit formed therein and disposed on the second main face of said support;
• and
• electrical connections for connecting the terminals of said chip to said tabs, said method comprising the following steps:
• (a) a cavity is made in the body of said card, said cavity including a first hollow opening out into a first one of said main faces of said body and having a bottom which is substantially parallel to said main faces of said body, and a second hollow opening out into said bottom, said first and second hollows having dimensions in planes parallel to said main faces of said body which are greater respectively than the dimensions of said insulating support and the dimensions of said chip, said bottom having a plurality of bumps projecting into said first hollow and separated from one another and from said second hollow by intercommunicating interstices, the distances between said first main face of the body and said bottom and the tops of said bumps being respectively greater than and less than the thickness of said support;
• (b) said module is placed in said cavity in such a manner as to cause said chip to penetrate partially into said second hollow and to cause said support to penetrate partially into said first hollow, the portion of said support which is not covered by said chip resting on said bumps;
• (c) said bumps are locally raised to their softening temperature and pressure is applied to said electronic module to crush the tops of said bumps until said contact tabs are substantially in the same plane as said main face of said body, said support thus adhering to said bumps;
• and
• (d) an insulating glue is caused to penetrate at least into said interstices between said bottom and said insulating support in order to provide additional adherence between said electronic module and said card body.