Aromatic polyimide compositions of high solubility and their uses
AssigneeInstitut Francais du Petrole
InventorsGuy Rabilloud, Michel Senneron, Choua Cohen, Paul Mariaggi, Bernard Sillion
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Abstract
Aromatic polyimide compositions, useful in particular for manufacturing adhesive materials, varnishes and films withstanding high temperatures, having a high solubility in organic solvents, particularly polar solvents and which are manufactured by reacting, in such a solvent, a tetraester or diacid-diester of benzhydrol 3,3', 4, 4' tetracarboxylic acid with an aromatic diamine for a sufficient time to obtain a polycondensation reaction product having an inherent viscosity at 30.degree. C., at a concentration of 5 g/liter in N-methyl pyrrolidone, ranging from 0.1 to 2 dl/g.
Claims51
A polyimide composition of high solubility, in polar organic solvents which is manufactured by reacting at least one aromatic diamine with at least one tetraester or diacid-diester derived from benzhydrol 3,3',4,4'-tetracarboxylic acid, under conditions which effect polycondensation and imide cyclization thereof, the reaction being continued until an inherent viscosity of at least 0.1 dl/g and at most 2 dl/g is obtained, said viscosity being measured in N-methyl pyrrolidone at 30.degree. C. at a concentration of 5 g of composition per liter of N-methyl pyrrolidone, and to a rate of progress of 90-99.9%, thereby removing a major part of the volatile polycondensation/imidization products.
A carbinol containing polyimide curable at temperatures of about 200.degree.-400.degree. C., which is prepared by reacting a 3,3+,4,4'-benzhydrol tetracarboxylic diester-diacid, with a polyfunctional heterocyclic or aromatic primary amine using a molar ratio of 0.67:1 to 1.5:1, the reaction being carried out in an inert organic solvent at a temperature sufficient to effect polymerization and imidization and at a rate of progress of 90-99.9%, thereby removing a major part of the volatile polycondensation/imidization products.
An organic solution containing a carbonyl containing polyimide, useful for preparing an adhesive film curable at 200.degree.-400.degree. C., which is prepared by reacting a molar excess of a 3,3',4,4'-benzhydroltetracarboxylic diester-diacid, with an aromatic diamine selected from the group consisting of 4,4'-methylenedianiline, 4,4'-oxydianiline, 4,4'-sulfonyldianiline, 4,4'-bis(3-aminobenzoyl)diphenyl ether, m-phenylenediamine, bis(3-aminopropyl)tetramethyl disiloxane, and 1,3-bis(3-aminophenoxy)benzene using a molar ratio of up to 1.5:1, the reaction being carried out in an inert polar organic solvent at between about 100.degree.-250.degree. C. and at a rate of progress of 90-99.9%, thereby removing a major part of the volatile polycondensation/imidization products.
A process for preparing a polyimide curable at temperatures of 200.degree.-400.degree. C., which comprises the steps of:
- (a) reacting a 3,3',4,4'-benzhydroyltetracarboxylic diester-diacid compound with an aromatic diamine at about 100.degree.-150.degree. C. in an inert polar organic solvent using a molar ratio of tetracarboxylic acid compound to diamine of 0.67:1 to 1.5:1;
- and at a rate of progress of 90-99.9%, and
- (b) removing the water and/or alcohol byproducts.
Dependencies are inferred from the claim text.