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US 4,736,010 AGranted
Epoxy resin curing composition
AssigneesAsahi Denka Kogyo Kabushiki Kaisha, A.C.R. Co., Ltd.
InventorsHiroshi Suzuki, Yutaka Asakawa
Life of this patent
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Abstract
An epoxy resin curing composition comprising a novel curing agent which is obtained by the amidation with elimination of alcohol between an adduct of a carboxyl-containing acrylonitrile-butadiene copolymer with an epoxidized fatty acid ester and an amide-forming nitrogenous compound. This composition exhibits improved adhesion involving peel strength to plastics, rubbers or flexible vinyl chloride resins and is excellent in mechanical strength and resistance to water and alkali and particularly to acid.
Claims6
A curable composition for an epoxy resin, which comprises
- (I) an epoxy compound having more than one vicinal epoxy groups on the average in the molecule and
- (II) an amide compound modified with an acrylonitrile-butadiene copolymer fatty acid ester, obtained by reacting (a) a carboxyl group-containing acrylonitrile-butadiene copolymer with (b) an epoxidized fatty acid ester having more than 0.5 epoxy group on the average and more than 0.5 ester group on the average, at an equivalent ratio of the carboxyl group of (a) to the epoxy group of (b) in the range between 1:0.5 and 1:2.0 to obtain (c) an adduct of (a) and (b), and further reacting the adduct (c) with (d) a nitrogen-containing compound to form the amide compound.
Dependencies are inferred from the claim text.