Method for depositing material on depressions
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsShunpei Yamazaki, Takashi Inujima
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Abstract
An improved method for depositing material on substrate is shown. The material to be deposited is energized by irradiation with light in a chamber in which CVD method is carried out. The energy induced by the irradiation remains in the molecules of the material even after the molecules have lain on the substrate. With the residual energy, the molecules can wander on the substrate even to a hidden surface. Due to this wandering, the deposition can be performed also on the inside of a deep cave.
Claims4
A method for coating, with a uniform film, the surface of a substrate and a depression formed on said surface having a width less than 2.5 micron meters, comprising the steps of:
- disposing said substrate in a reaction chamber;
- inputting a reactive gas to said reaction chamber;
- irradiating said reactive gas with light to initiate optical reaction and depositing the product on the surface of said substrate, more than half of the exciting energy of said product being attributed to said irradiation, whereby the inside of said trench is coated with a uniform film by virtue of surface migration.
Dependencies are inferred from the claim text.