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US 4,734,825 AGranted
Integrated circuit stackable package
AssigneeMotorola, Inc.
InventorWilliam M. Peterson
Life of this patent
Estimating the term…
Abstract
An apparatus comprising a plurality of disks made up of interconnect devices enclosed in a housing is disclosed. The disks each have a plurality of connectors disposed about their peripheries such that the disks may be stacked and the plurality of connectors will form bus lines for the device. A connecting disk is then placed at one end of the disk stake to provide connecting leads, or pins, to the outside. These disks may then be enclosed within a housing to provide protection from the environment.
Claims18
An integrated circuit stackable package comprising:
- a gear shaped interconnect device having a first surface, a second surface, and a plurality of gear shaped teeth spaced about a periphery of said interconnect device;
- a plurality of conductive contacts being disposed about said plurality of gear shaped teeth;
- and
- an integrated circuit being coupled to said gear shaped interconnect device, said integrated circuit having a plurality of leads each being coupled to one of said plurality of conductive contacts.
1 more element
An integrated circuit stackable package comprising a plurality of disks each having:
- an interconnect device having a first surface, a second surface and a periphery;
- an integrated circuit having a plurality of leads and being coupled to said interconnect device;
- heat dissipating means for dissipating heat generated by said integrated circuit, said heat dissipating means having a first surface being coupled to said second surface of said interconnect device, and a second surface;
- a first housing portion having a periphery, a first surface coupled to said second surface of said heat dissipating means, and a second surface;
- a second housing portion having a periphery, a first surface, and a second surface being coupled to said first surface of said interconnect device;
- and
- a plurality of bus connectors disposed about said peripheries of said interconnect device, said first housing portion and said second housing portion, said plurality of bus connectors being coupled to said plurality of leads of said integrated circuit.
4 more elements
An integrated circuit stackable package comprising:
- a plurality of disks each having:
- an interconnect device having a first surface, a second surface and a periphery;
- an integrated circuit having a plurality of leads and being coupled to said interconnect device;
- heat dissipating means for dissipating heat generated by said integrated circuit, said heat dissipating means having a first surface being coupled to said second surface of said interconnect device, and a second surface;
- a first housing portion having a periphery, a first surface coupled to said second surface of said heat dissipating means, and a second surface;
- a second housing portion having a periphery, a first surface, and a second surface being coupled to said first surface of said interconnect device;
- and
- a plurality of bus connectors disposed about said peripheries of said interconnect device, said first housing portion and said second housing portion, said plurality of bus connectors being coupled to said plurality of leads of said integrated circuit;
- a heat bridge being disposed about said plurality of disks and being coupled to said heat dissipating means;
- a top cap having a periphery, a first surface, and a second surface being coupled to said first surface of said second housing portion;
- a plurality of bus connectors being disposed about said peripheries of said top cap, said plurality of bus connectors being coupled to said plurality of bus connectors disposed about said periphery of said interconnect device, said first housing portion and said second housing portion;
- a plurality of pins being disposed on said first surface of said top cap, said plurality of pins being coupled to said plurality of bus connectors disposed about said periphery of said to cap;
- an external housing being disposed about said interconnect device, said heat dissipating means, said first housing portion, said second housing portion and said top cap;
- a top connector having a first end for receiving said pins of said top cap and a second end being coupled to an external cable.
11 more elements
Dependencies are inferred from the claim text.