Polyimide from ether diamine having the indane structure and high-temperature adhesive of polyimide

A method for preparing polyimide having recurring units of the formula ##STR24## (where Y is a divalent radical represented by the formula ##STR25## which is an indan derivative having two oxy radicals, and Y is bonded to both phenyl radicals either in meta or in para positions, and R is a tetravalent radical selected from the group consisting of aliphatic radicals having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function),

• which comprises reacting a diamine having the formula ##STR26## (where Y is the same as above) with a tetracarboxylic dianhydride having the formula ##STR27## (where R is the same as above) in an organic solvent, and thermally or chemically imidizing resultant polyamic acid having recurring units of the formula ##STR28## (where Y and R are the same as above).

A method for adhesion which comprises applying polyimide having recurring units of the formula ##STR30## (where Y is a divalent radical represented by the formula ##STR31## which is an indan derivative having two oxy radicals, and Y is bonded to both phenyl radicals either in meta or in para positions, and R is a tetravalent radical selected from the group consisting of aliphatic radicals having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function) on a substrate, overlapping the applied surface of said substrate with untreated or applied surface of another substrate, and heating under pressure above the glass transition temperature of said polyimide.