High density shielded modular connector for stacking printed circuit boards and method of making thereof
AssigneeAmphenol Corporation
InventorMyron Pavlacka
Life of this patent
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Abstract
The invention relates to a modular connector assembly which is used in stacking plural printed circuit boards in a vertical configuration. The connector housing is made up of a plurality of corrugated sheets which have been assembled side by side and spot welded together to define a honeycomb array of passages. Dielectric surrounded contacts making up contact inserts are inserted into the respective passages to provide the connector. The invention also relates to a method assembling such a connector housing.
Claims7
An EMI shielded interconnect for electrically connecting vertically stacked printed circuit boards, said interconnect comprising a housing having a plurality of passages extending vertically therethrough in a matrix arrangement, said housing being made up of a plurality of stamped corrugated sheets of shielding material which have been bonded to each other in an interfit manner, and each passage in said housing having a respective contact engageably received therein.
Dependencies are inferred from the claim text.