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US 4,734,045 AGranted
High density connector
AssigneeMasterite Industries, Inc.
InventorJohn L. Hawkins
Life of this patent
Estimating the term…
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AssigneeMasterite Industries, Inc.
InventorJohn L. Hawkins
Estimating the term…
A high density connector for connecting multiple circuits between printed circuit boards or the like is formed of inter-engaging mating, first and second connector halves formed of an electrical insulating material with said connector halves including opposed connection faces having uniform width and height undulations forming alternating flattened peaks and valleys of limited width with the peaks and valleys having an electrically conductive coating thereon to form longitudinally spaced transversely offset contacts at the peaks and valleys. The connection faces of the respective connector halves bear mirror image undulations. The center to center distance between longitudinally adjacent contacts is less than the peak to valley distance between those contacts to increase the electrical creapage path between longitudinally adjacent contacts of the mating first and second connector halves. Circuits are completed between one or more of the connector halves and printed circuit boards or cards fixed thereto by selectively removing a coating of solder mask which overlies extensions of the electrically conductive coatings on the peaks and valleys which extend along companion surfaces of the connector halves with the solder mask coating guaranteeing against shorting between adjacent printed circuit boards during unmating of the connector halves. The printed circuit boards may be co-planar stacked and separated by the joined male and female connector halves or the female connector half which may include a second slot opposite that receiving the male connector half which permits right angle electrical mounting and connecting of a daughter card to an underlying mother board.
A high density connector for connecting multiple circuits between printed circuit boards and the like, said connector consisting of inter-engaging, mating first and second connector bodies formed of an electrical insulating material, one of said bodies including at least one connection face having uniform width and height undulations forming alternating flattened-peaks and valleys of limited width with the peaks and valleys having an electrically conductive coating thereon to form longitudinally spaced, transversely offset contacts at said peaks and valleys, said second connector body including a connection face bearing mirror image undulations to said at least one connection face of said first connector body of similar uniform width and height and forming alternating, flattened peaks and valleys of limited width with said peaks and valleys of said undulating connection face of said second body being electrically conductively coated to form mirror image longitudinally separate and transversely offset contacts to those on said first connector body and wherein the connection faces of said bodies are in contact with each other with electrical circuits completed between abutting contacts, and wherein the longitudinal center to center distance between longitudinally adjacent contacts is less than the peak to valley distance between those contacts to increase the electrical creapage path between longitudinally adjacent contacts of said mating first and second bodies.
Dependencies are inferred from the claim text.