Method of making a multiple-pin heatsink
AssigneePinFin, Inc.
InventorJohn H. Jacoby
Life of this patent
Estimating the term…
Abstract
A method of making a multiple-pin heatsink which includes forming in the upper surface of a die member a plurality of pin-receiving holes, each with a depth which is less than the length of a respective pin and forming in a base element a plurality of pin-receiving holes which correspond to the pin holes in the die member. The pins are introduced into the holes in the die member and the base element is mounted on the upper surface of the die member so that each pin extends through and above a respective hole in the base element. Sufficient downward force is applied to the upper ends of the pins to cold swage the pins into permanent attachment with the base element and the attached pins and base element are then removed from the die member.
Claims13
A method of making a multiple-pin heatsink comprising:
- forming in the upper surface of a die member a plurality of pin-receiving holes, each with a depth which is less than the length of a respective pin;
- forming in a base element a plurality of pin-receiving holes which correspond to the pin holes in said die member;
- introducing the pins into the holes in said die member and mounting said base element on the upper surface of said die member so that each said pin extends through and above a respective hole in said base element;
- applying sufficient downward pressure to the upper ends of said pins to cold swage and expand said pins into permanent attachment above and below said base element;
- and
- removing said base element and said attached pins from said die member.
Dependencies are inferred from the claim text.