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US 4,733,328 AGranted
Process for manufacturing capacitive devices and capacitive devices manufactured by the process
AssigneeAllied Corporation
InventorDaniel C. Blazej
Life of this patent
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Abstract
This invention relates to a laminated capacitive element for use in electrical devices such as filtered connectors, said element comprising a laminated body of a metal substrate having one or more layered structures heat bonded to all or a portion of the surfaces thereof, said structures comprising a non-conductive layer composed of a sintered finely divided non-conductive material heat bonded to said metal substrate and a metal conductive layer composed of sintered finely divided metal heat bonded to said sintered non-conductive material.
Claims34
A capacitive element which comprises:
- a laminated body comprising a metal substrate having one or more layered structures heat bonded to all or a portion of the surfaces thereof, each of said structures comprising a nonconductive layer comprised of sintered finely divided barium titanate and one or more glasses selected from the group consisting of alkali metal borates, silicates and germanates heat bonded to said metal substrate, and a metal conductive layer comprised of a sintered finely divided metal heat bonded to said non-conductive layer.
Dependencies are inferred from the claim text.