Treatment of alkoxysilanes
AssigneeDow Corning Corporation
InventorsKenneth W. Moorhead, Kirsten L. Reading, David J. Rengering, Antony P. Wright
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Abstract
A process in which the residual chloride impurities in crude alkoxysilanes with atmospheric boiling points below 130.degree. C. are reduced in order to render the resultant alkoxysilanes more suitable as a starting intermediate for the preparation of other chemical compounds and for use in electronics applications is described. The essence of the process is contacting the alkoxysilane with an alkaline metal compound using superatmospheric pressure to achieve a treatment temperature of greater than 130.degree. C.
Claims21
A process for reducing residual chloride level in an alkoxysilane having a boiling point at atmospheric pressure of less than about 130.degree. C., said process comprising:
- (A) contacting at a pressure greater than atmospheric and at a temperature of higher than about 130.degree. C. the alkoxysilane and an alkaline metal compound, said compound being selected from a group consisting of (i) alkaline metal oxides and (ii) alkaline metal hydroxides;
- (B) cooling the materials so contacted;
- and
- (C) separating any residual solids from the alkoxysilane, said residual solids comprising at least unreacted alkaline metal compound and salts resulting from the reaction of the alkaline metal compound and the residual chloride.
Dependencies are inferred from the claim text.