Epoxy type spherical particulate adhesive and process for preparation thereof
AssigneeToray Industries, Inc.
InventorKoichiro Oka
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Abstract
A spherical particulate adhesive comprising particles of a partially amine cured epoxy resin as the main component and having an average particle size of 0.3 to 500 .mu.m, in which particles of the epoxy resin contain an at least partially compatible agent homogeneously in the interior thereof. This adhesive is a heat-curable adhesive and has a very high bonding force. After bonding, the adhesive is chemically stable and is especially preferably used for bonding in the field of electronic material, such as liquid crystal display devices, which are apt to be degraded by impurities and for which high-precision bonding is required.
Claims20
An epoxy spherical particulate adhesive comprising particles of a partially amine cured epoxy resin as the main component, wherein the epoxy resin contains an at least partially compatible latent curing agent in the interior of the particles, the average particle diameter is 0.3 to 500 .mu.m, and substantially all the epoxy resin particles are spherical.
A process for the preparation of an epoxy spherical particulate adhesive comprising a partially amine cured epoxy resin as the main component, which comprises emulsifying or suspending an epoxy compound having a latent curing agent incorporated therein into a liquid composed mainly of water to form spherical particles.
A process for the preparation of an epoxy spherical particulate adhesive comprising a partially amine cured epoxy resin as the main component, which comprises mixing an aqueous slurry obtained by emulsifying or suspending an epoxy compound containing a latent curing agent compatibly therein into a liquid composed mainly of water to form spherical particles, with a slurry of fine particles of an inorganic oxide having an average particle diameter smaller than 0.2 .mu.m, and stirring the mixture to obtain an epoxy type spherical particulate adhesive covered with the inorganic oxide.
A process for the preparation of an epoxy type spherical particulate adhesive according to claim 21, wherein the latent curing agent is an adduct of a bisphenol diglycidyl ether or a condensation product thereof and a polyhydric phenol compound.
Dependencies are inferred from the claim text.