Package for semiconductor device

Abstract

A package suitable to contain therein a semiconductor memory element erasable of the stored information by irradiation with ultraviolet rays on the element with no fear of weak ultraviolet rays such as contained in natural light undesirably acting on the semiconductor memory device to erase the information. In the package, a lid for closing a cavity over an insulating base, the insulating base having mounted thereon the semiconductor element, has an ultraviolet transmission glass provided at a portion thereof opposite to the semiconductor device, and the glass has at least one surface formed into a rough surface having a transmittance of ultraviolet rays of 80% or less. Thus, the ultraviolet transmission glass is lower in transmittance due to the rough surface and The transmission of the weak ultraviolet rays is intercepted by the rough surface, whereby the information stored in the semiconductor memory element is not undesirably erased by the weak ultraviolet rays.

Dependencies are inferred from the claim text.